Qualcomm officially released the Snapdragon 888 Plus 5G mobile platform this Monday. After that, Xiaomi, Vivo, Honor, ROG, etc. tried to voice support. It is expected that the first batch of Snapdragon 888+ models will be launched. The digital blogger @Both models are 100W fast charge and under-screen camera models, and both use curved screen design.
There is not much information currently known about the Honor Magic 3. Previously, Zhao Ming said that the Magic 3 high-end flagship will be equipped with Snapdragon 888 and will be released in the third quarter of this year. But previously, the digital blogger leaked the news that Honor Magic has tested the Snapdragon 888+ chip or the top version; and the screen ratio of Mi MIX 4 is similar to that of Mi 11.
Honor Magic 3 uses BOE’s under-screen solution, while Xiaomi Mi MIX 4 is Huaxing Optoelectronics’ 1080p+ under-screen solution. The hyperboloid AMOLED screen is expected to be around 6.67 inches, or it will support high refresh rates.
Read Also: Xiaomi Mi Mix 4 Leaks With a Bezel-Less Screen and Under-Display Camera
In addition to Honor and Xiaomi, in the third quarter of this year, ZTE (or July), Samsung (or August), Vivo, and other manufacturers are also expected to launch their own under-screen camera models on the same stage. Competition is not yet known who can win more markets.
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