Blogger digital chat station revealed that Qualcomm’s iterative platform Snapdragon 8 Gen3 is progressing quickly, and the first Xiaomi 14 equipped with Qualcomm Snapdragon 8 Gen3 will be released in advance.
In addition to the Qualcomm Snapdragon 8 Gen3, Mi 14 will also use Huaxing’s latest ultra-narrow bezel panel, with a bezel width of only 1mm. For comparison, the Mi 13 bezel width is 1.61mm, the iPhone 14 bezel width is 2.4mm, and the iPhone 14 Pro bezel width is 2.15mm.
This screen adopts a new circuit structure design, transfers the Fanout wiring to the AA display area, saves the fanout wiring space required by the lower border, and makes the lower border of the panel narrower than the existing product by at least 20%.
Moreover, Huaxing realizes the network distribution of the power supply VSS signal in the AA luminous region through the new routing design within the pixel, and reduces the metal resistance value of the transmission power signal. The data show that without increasing the bezel of the panel, the panel with narrow bezel technology can reduce the luminous power consumption of about 8% at the same brightness.
More importantly, Huaxing has developed the FIAA Slim design, a new design that can effectively reduce the manufacturing process with narrow bezel technology panels and improve production efficiency.
The Mi 14, which uses Huaxing’s extremely narrow frame and straight screen, will debut in November at the earliest.
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