Vivo X60 Pro+, the first Chinese-made extra-large Snapdragon 888 flagship phone, will be officially released on January 21 at 19:30 PM.
According to @rodent950, in addition to the Snapdragon 888 version, there is also expected to be a version powered by the Snapdragon 875.
Based on previous information, Snapdragon 875 exposed this time should be the Snapdragon 870 chip, which is a new processor that has not yet been released by Qualcomm.
According to previous reports, the Snapdragon 875’s Geekbench score is 1034 points for a single core and 3513 points for a multi-core, which is much higher than the Snapdragon 865’s score and even close to the current flagship Snapdragon 888. Qualcomm will likely launch this chip as its second flagship product.
So far, the source has revealed more about this particular Vivo X60 Pro+ version, but based on its chip positioning, Vivo is likely to pair the two different processor versions with basically the same configuration, but the Snapdragon 875 version should cost a bit less.
According to previous sources, the Vivo X60 PRO + and X60 PRO look basically the same, the front with a center perforated curved screen design, the back design slightly changed, the rear camera changed to L-shaped matrix module, with Zeis’s signature small blue logo, the source said that the main camera will use a custom 1/1.3 inch large bottom sensor.
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The T coated lens developed by Vivo and Zeiss will not be absent, which can effectively improve the transmittance of the lens, reduce glare, and thus effectively reduce astigmaticity, field curvature and distortion. Meanwhile, the unique Zeiss imaging style is enhanced, and the imaging effect is significantly enhanced.
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