Snapdragon 775, 775G Chips Leaked 5nm Manufacturing Process

Information about the parameters of Qualcomm’s upcoming mid-range Snapdragon 775/775G chip has been leaked, and some of the information doesn’t match what was previously reported. The chip will be made using a 5nm process, rather than a previously rumored 6nm process. The chip will support LPDDR4X 2400MHz and LPDDR5 3200MHz memory.

The Snapdragon 775/775G will be powered by Kryo 6XX CPU cores, but no specific core size has been disclosed. In addition, the series of SoCs will support UFS 3.1 Two-Lane HS Gear4, boosting bandwidth to 11.6Gbps and up to 23.2Gbps, or 2.9 Gb /s, for two-way read-write bandwidth.

It has learned that these two SoCs will be equipped with Spectra 570 ISP image processing chips and will support 4K 60fps recording and multiple cameras working simultaneously, with 64MP+20MP cameras operating at a frame rate of up to 30fps. The new processor also supports Wi-Fi 6E, MMW 5G, SA/NSA dual-mode 5G, and N77, N78, and N79 network channels.

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According to previous reports, Xiaomi MI CC 10 series phones are expected to be powered by the Snapdragon 775G chip, and the performance is expected to be as good as the Snapdragon 855.

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